Suzhou Tianhong Laser Co., Ltd

Showing 61 - 70 of 96, total 10 pages [First] [Previous] [Next] [Last]

double path laser wire/cable stripping machine
Specification: TH-CO2LPS
Detail: Introduction 1.Double light path design, simultaneous working on diagonal; 2.Table belt synchronous transit, linked with laser power and stripping speed; 3.Software control, adjustable speed, which is with good stripping ef...

pcb automatic double sided laser marking system green
Specification: TH-PCB-M
Detail: Features 1.High intelligence, high production efficiency, high precision, strong system stability, automatic scanning and error alarm function, high protection level, fully meet the requirements of environmental protection. ...

pcb automatic double sided laser marking system uv
Specification: TH-PCB-M
Detail: Features 1.High intelligence, high production efficiency, high precision, strong system stability, automatic scanning and error alarm function, high protection level, fully meet the requirements of environmental protection. ...

pcb automatic double sided laser marking system co2
Specification: TH-PCB-M
Detail: Features 1.High intelligence, high production efficiency, high precision, strong system stability, automatic scanning and error alarm function, high protection level, fully meet the requirements of environmental protection. ...

pcb automatic double sided laser marking system
Specification: TH-PCB-M
Detail: Features 1.High intelligence, high production efficiency, high precision, strong system stability, automatic scanning and error alarm function, high protection level, fully meet the requirements of environmental protection. ...

co2 laser cutting machine
Specification: TH-CO2LMS100
Detail: Feature 1.Imported laser source, with good cutting effect and long service life. 2.Imported galvo with fine cutting line, high speed and stability. 3.Equipped with ventilation system. 4.Equipped with adsorption platform, w...

wafer laser marking machine
Specification: TH-WLMS
Detail: Introduction 1.Professional device for semiconductor industry. 2.All-solid-state laser as source, equipped with high speed digital galvo assisted by 2D liner motor and DC driven rotating platform. Automatic CCD positioning. ...

film solar cell edge laser cleaning machine
Specification: TH
Detail: Feature 1.The device can move the platform longitudinally and the optical box horizontally according to the need, so that the laser head can be scanned quickly under the designated area the battery chip, and the film layer of...

film solar cell laser scribing machine
Specification: TH
Detail: Feature 1.In order to obtain high efficiency amorphous /microcrystalline silicon laminated thin film solar cell, laser cutting is one of the key technologies to achieve the good performance of the components. The equipment of...


Showing 61 - 70 of 96, total 10 pages [First] [Previous] [Next] [Last]
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